Methods for providing and using grid array packages

ABSTRACT

Methods for providing and using semiconductor device assemblies or packages include providing or using various elements of a semiconductor device assembly or package. Such a semiconductor device package or assembly may include a substrate and a semiconductor die adjacent to a first surface of the substrate. The substrate of such a semiconductor device assembly or package may also include a second surface opposite from the first surface, an opening extending from the first surface and the second surface, contact pads on the second surface, and substrate pads on the second surface, adjacent to the opening. Bond pads of the semiconductor die may be aligned with the opening through the substrate. Intermediate conductive elements, such as bond wires, may extend from bond pads of the semiconductor die, extend through the opening, protrude beyond the second surface of the substrate, and extend to substrate pads on the second surface. An encapsulant, which may fill the opening and cover the intermediate conductive elements, protrudes beyond a plane in which the second surface of the substrate is located. Discrete conductive elements, such as solder balls, may protrude from the contact pads of the substrate.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of application Ser. No. 11/437,550, filed May 19, 2006, now U.S. Pat. No. 7,381,591, issued Jun. 3, 2008, which is a continuation of application Ser. No. 11/070,364, filed Mar. 1, 2005, now U.S. Pat. No. 7,329,945, issued Feb. 12, 2008, which is a continuation of application Ser. No. 09/699,537, filed Oct. 30, 2000, now U.S. Pat. No. 6,861,290, issued Mar. 1, 2005, which is a divisional of application Ser. No. 09/483,483, filed Jan. 14, 2000, now U.S. Pat. No. 6,265,766, issued Jul. 24, 2001, which is a continuation of application Ser. No. 08/948,936, filed Oct. 10, 1997, now U.S. Pat. No. 6,201,304, issued Mar. 13, 2001, which is a continuation of application Ser. No. 08/574,662, filed Dec. 19, 1995, now U.S. Pat. No. 5,719,440, issued Feb. 17, 1998. The disclosure of each of the previously referenced U.S. patent applications and patents referenced is hereby incorporated by reference in its entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an apparatus for connecting a bare semiconductor die having a size and bond pad arrangement, either solder ball arrangement, or pin arrangement (hereinafter referred to generally as a “terminal arrangement”), which does not conform to a printed circuit board with a specific or standardized pin out, connector pad, or lead placement (hereinafter referred to generally as a “connection arrangement”). More particularly, the present invention relates to an intermediate conductor-carrying substrate (hereinafter referred to generally as an “adaptor board”) for connecting a non-conforming bare die to another printed circuit board having a given connection arrangement (hereinafter referred to generally as a “master board”).

2. State of the Art

Definitions: The following terms and acronyms will be used throughout the application and are defined as follows:

BGA—Ball Grid Array; An array of minute solder balls disposed on an attachment surface of a semiconductor die wherein the solder balls are refluxed for simultaneous attachment and electrical communication of the semiconductor die to a printed circuit board.

COB—Chip On Board: The techniques used to attach semiconductor dice to a printed circuit board, including flip-chip attachment, wire bonding, and tape automated bonding (“TAB”).

Flip-Chip: A chip or die that has bumped terminations spaced around the active surface of the die and is intended for facedown mounting.

Flip-Chip Attachment: A method of attaching a semiconductor die to a substrate in which the die is flipped so that the connecting conductor pads on the face of the die are set on mirror-image pads on the substrate (i.e., printed circuit board) and bonded by refluxing the solder.

Glob Top: A glob of encapsulant material (usually epoxy or silicone or a combination thereof) surrounding a semiconductor die in the COB assembly process.

PGA—Pin Grid Array: An array of small pins extending substantially perpendicularly from the major plane of a semiconductor die, wherein the pins conform to a specific arrangement on a printed circuit board for attachment thereto.

SLICC—Slightly Larger than Integrated Circuit Carrier: An array of minute solder balls disposed on an attachment surface of a semiconductor die similar to a BGA, but having a smaller solder hall pitch and diameter than a BGA.

State-of-the-art COB technology generally consists of three semiconductor dies to printed circuit boards attachment techniques: flip-chip attachment, wire bonding, and TAB.

Flip-chip attachment consists of attaching a semiconductor die, generally having a BGA, a SLICC or a PGA, to a printed circuit board. With the BGA or SLICC, the solder ball arrangement on the semiconductor die must be a mirror-image of the connecting bond pads on the printed circuit board such that precise connection is made. The semiconductor die is bonded to the printed circuit board by refluxing the solder balls. With the PGA, the pin arrangement of the semiconductor die must be a mirror-image of the pin recesses on the printed circuit board. After insertion, the semiconductor die is generally bonded by soldering the pins into place. An under-fill encapsulant is generally disposed between the semiconductor die and the printed circuit board to prevent contamination. A variation of the pin-in-recess PGA is a J-lead PGA, wherein the loops of the Js are soldered to pads on the surface of the circuit board. Nonetheless, the lead and pad locations must coincide, as with the other referenced flip-chip techniques.

Wire bonding and TAB attachment generally begins with attaching a semiconductor die to the surface of a printed circuit board with an appropriate adhesive. In wire bonding, a plurality of bond wires are attached, one at a time, from each bond pad on the semiconductor die and to a corresponding lead on the printed circuit board. The bond wires are generally attached through one of three industry-standard wire bonding techniques: ultrasonic bonding, using a combination of pressure and ultrasonic vibration bursts to form a metallurgical cold weld; thermocompression bonding, using a combination of pressure and elevated temperature to form a weld; and thermosonic bonding, using a combination of pressure, elevated temperature, and ultrasonic vibration bursts. The die may be oriented either face up or face down (with its active surface and bond pads either up or down with respect to the circuit board) for wire bonding, although face up orientation is more common. With TAB, metal tape leads are attached between the bond pads on the semiconductor die and the leads on the printed circuit board. An encapsulant is generally used to cover the bond wires and metal tape leads to prevent contamination.

Although the foregoing methods are effective for bonding semiconductor dice to printed circuit boards, the terminal arrangements of the dice and the connection arrangements of the boards must be designed to accommodate one another. Thus, it may be impossible to electrically connect a particular semiconductor die to a printed circuit board for which the semiconductor die terminal arrangement was not designed to match the board's connection arrangement. With either wire bond or TAB attachment, the semiconductor die bond pad may not correspond to the lead ends on the circuit board, and thus attachment is either impossible or extremely difficult due to the need for overlong wires and the potential for inter-wire contact and shorting. With flip-chip attachment, if the printed circuit board connection arrangement is not a mirror-image of the solder ball or pin arrangement (terminal arrangement) on the semiconductor die, electrically connecting the flip-chip to the printed circuit board is impossible.

Therefore, it would be advantageous to develop an apparatus for connecting a semiconductor die having a size and bond pad arrangement, solder ball arrangement, or pin arrangement (“I/O pattern”) which does not conform to a printed circuit board with a specific or standardized pin out, connection pad location, or lead placement (“I/O pattern”).

SUMMARY OF THE INVENTION

The present invention relates to an intermediate printed circuit board or other conductor-carrying substrate that functions as an adaptor board for electrically connecting one or more bare semiconductor dice of a variety of sizes and bond pad locations, solder ball arrangement, or pin arrangement, to a master printed circuit board with a specific or standardized pin out, connector pad location, or lead placement.

An adaptor printed circuit board or substrate (“adaptor board”) is sized and configured with an I/O pattern to accommodate its attachment to the master printed circuit board (“master board”). If the master board is configured to receive a specific pin out or specific connector pad locations, the adaptor board is configured on its master board attachment surface with pins or solder balls in mirror-image to the master board connection arrangement to make electrical contact with the specific pin out or connector pads on the printed circuit board. If the master board is configured to receive a bond wire, the adaptor board is configured and sized to provide wire bond pads on its upper surface closely adjacent the bond pads of the master board leads. The adaptor board can, of course, be configured to accommodate other attachment and electrical connection means known in the industry, as well as other components in addition to the semiconductor die or dice carried thereon.

On the semiconductor die side of the adaptor board, one or more semiconductor dice are attached. If a “flip-chip” die is attached to the adaptor board, the adaptor board will, of course, be configured with an I/O pattern to receive the flip-chip with a specific pin out or connector pad locations. The pin out or connector pads on the adaptor board are connected to circuit traces on or through the adaptor board. The circuit traces form the electrical communication path from the pin recesses or connector pads on the adaptor board to the connection points to the master board.

If a “leads over” die is used with the adaptor board, the bond pads on the die are wire bonded to the adaptor board. Preferably the leads over die is attached to the adaptor board with the bond pads facing the adaptor board. The bond wires are attached to the leads over die bond pads and extend into a via or vias in the adaptor board. The bond wires are attached to an I/O pattern of adaptor board bond pads within the via from which circuit traces extend, or to leads on the master board side of the adaptor board.

It is, of course, understood that the leads over die can be attached to the adaptor board with the bond pads facing away from the adaptor board. Thus, the bond wires are simply attached to the bond pads on the leads over die and to a corresponding I/O pattern of adaptor board pad on the semiconductor die side of the adaptor board.

Preferably, the exposed circuitry of the die and the die-to-adaptor board interconnection is sealed from contamination by a glob top after wire bonding or an underflow compound in the case of a flip-chip attachment.

Furthermore, it is understood that with the use of wire bonds, the adaptor boards can be stacked on top of each other and connected to the adaptor board as by wire bonding.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

While the specification concludes with claims particularly pointing out and distinctly claiming that which is regarded as the present invention, the advantages of this invention can be more readily ascertained from the following description of the invention when read in conjunction with the accompanying drawings in which:

FIG. 1 is a side view of one embodiment of the present invention;

FIG. 2 is a side view of a second embodiment of the present invention;

FIG. 2A is a top view of the second embodiment of the present invention shown in FIG. 2;

FIG. 3 is a side view of a third embodiment of the present invention;

FIG. 3A is a upside-down exploded perspective view of selected portions of the third embodiment; and

FIG. 4 is a side view of a fourth embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 illustrates a first embodiment of the present invention designated as a flip-chip style/flip-chip attachment assembly 100. Assembly 100 comprises a semiconductor die 12 having an inverted active surface 14 with at least one flip-chip electric connection 16 (such as a C4 solder bump connection, a pin connection, or a surface mount J-lead connection, by way of example) extending substantially perpendicularly from a bond pad 15 on the semiconductor die active surface 14. The flip-chip electric connections 16 are attached to an upper surface 20 of an adaptor board 18 in such a manner that the flip-chip electric connections 16 make electrical contact with electrical contact elements 21 in or on the surface of adaptor board 18. The electrical contact elements 21 make electrical communication between each flip-chip electric connection 16, through circuit traces 23 (exempt traces shown in broken lines) in the adaptor board 18, to at least one master board connector 22 extending substantially perpendicularly from a lower surface 24 of the adaptor board 18 to connect adaptor board 18 to an aligned terminal 31 on master board 30. Preferably, a sealing compound 26 is disposed between the semiconductor die 12 and the adaptor board 18 to prevent contamination of the flip-chip electric connections 16 and to more firmly secure semiconductor die 12 to adaptor board 18.

In actual practice, there will be a plurality of terminals 31 arranged in a specific, perhaps industry-standard pattern, on master board 30, and master board connectors 22 will be arranged in a minor-image pattern to terminals 31 for mating connection therewith. Master board connectors 22 and terminals 31 may comprise any electrical connection mechanism known in the art, in addition to those previously described herein.

FIGS. 2 and 2A illustrate a second embodiment of the present invention designated as a flip-chip style/wire bond attachment assembly 200. Components common to both FIG. 1 and FIG. 2 retain the same numeric designation. The assembly 200 comprises the semiconductor die 12 having active surface 14 with at least one flip-chip electric connection 16, as known in the art, extending substantially perpendicularly from a bond pad 15 on the semiconductor die active surface 14. The flip-chip electric connections 16 are attached to the adaptor board upper surface 20 in such a manner that the flip-chip electric connections 16 make electrical contact with electrical contact elements 21 on the adaptor board 18. The electrical contact elements 21 communicate between each flip-chip electric connection 16 to bond pads 28 on the adaptor board upper surface 20 through circuit traces 23. The adaptor board lower surface 24 is bonded to an upper surface 36 of a master board 30 with an adhesive 32, which may comprise a liquid or gel adhesive, or an adhesive tape, all as known in the art. If desired, adhesive 32 may be a heat-conductive adhesive. A wire bond 34 extends from each adaptor board bond pad 28 to a corresponding bond pad or lead end 35 on the upper surface 36 of master board 30, bond pad or lead end 35 communicating with other components mounted to master board 30 or with other components on other boards or other assemblies through circuit traces or other conductors known in the art.

FIGS. 3 and 3A illustrate a third embodiment of the present invention designated as a wire bond style/flip-chip attachment assembly 300. Components which are common to the previous figures retain the same numeric designation. The assembly 3 comprises an inverted semiconductor die 12 having active surface 14 with at least one bond pad 38 on the semiconductor die active surface 14. As illustrated, the bond pads 38 are arranged in two rows extending down the longitudinal axis of semiconductor die 12 being located transverse to the plane of the page, such an arrangement commonly being used for a “leads over” connection to frame leads extending over the die in its normal, upright position. The semiconductor die active surface 14 is bonded to the adaptor board upper surface 20 with an insulating, sealing adhesive 40. The adaptor board 18 includes at least one or more wire bond vias 42 which is located in a position or positions aligned with the semiconductor die bond pads 38. Each individual wire bond 134 is connected to each corresponding individual semiconductor die bond pad 38. Each wire bond 134 extends from the semiconductor die bond pad 38 to a corresponding bond pad or lead 39 on the adaptor board lower surface 24, which communicates with master board connectors 22 through circuit traces 23. The master board terminals 31 are in electrical communication with at least one master board connector 22 extending substantially perpendicularly from the adaptor board lower surface 24. Preferably, a sealant 4 encases the bond wires 134 and seals the wire bond via 42 to prevent contamination and damage to the wire bonds.

FIG. 4 illustrates a fourth embodiment of the present invention designated as a wire bond style/wire bond attachment assembly 400. Components which are common to the previous figures retain the same numeric designation. The assembly 400 comprises the semiconductor die 12 having active surface 14 with at least one bond pad 38 on the semiconductor die active surface 14. As with the embodiment of FIG. 3, semiconductor die 12 in this instance employs bond pads 38 in a “leads over” configuration. The semiconductor die active surface 14 is bonded to the adaptor board upper surface 20 with an insulating, sealing adhesive 40. The adaptor board 18 includes at least one or more wire bond vias 42 which are located in a position or positions aligned with the semiconductor die bond pads 38. Each individual wire bond 134 is connected to each corresponding semiconductor die bond pad 38. Each wire bond 134 extends from the semiconductor die bond pad 38 to a corresponding bond pad 46 within the wire bond via 42. The via bond pads 46 are in electrical communication through circuit traces 23 with at least one corresponding adaptor board bond pad 28. The adaptor board lower surface 24 is bonded to the master board upper surface 36 with the adhesive 32. Wire bonds 34 extend from the adapter board upper surface 20 to a corresponding bond pad or lead end 35 on the master board upper surface 36. Preferably, the wire bond via sealant 44 encases the bond wires 134 and seals the wire bond via 42 to prevent contamination.

Having thus described in detail preferred embodiments of the present invention, it is to be understood that the invention defined by the appended claims is not to be limited by particular details set forth in the above description as many apparent variations thereof are possible without departing from the spirit or scope thereof. 

1. A method for providing a semiconductor device, comprising: providing a substrate with no more than one opening therethrough, the opening elongated along a center axis of the substrate, the substrate otherwise being substantially uniform in thickness and further comprising a first surface, a second surface opposite the first surface, a first array of substrate pads adjacent to a first side of the opening on the second surface, and a second array of substrate pads adjacent to a second side of the opening on the second surface wherein the first and second arrays have at least three rows of substrate pads parallel to the opening; providing a semiconductor die comprising die pads on an active surface; providing an adhesive material securing the semiconductor die to the first surface of the substrate with the active surface of the semiconductor die facing the first surface of the substrate; providing bond wires that extend between the die pads, through the opening, and to the first and second arrays of substrate pads; providing an encapsulant substantially filling the opening, the encapsulant covering the bond wires and protruding a first distance beyond a plane of the second surface of the substrate forming a protrusion beneath the opening, wherein the protrusion protrudes a first profile distance from the second surface; and providing solder balls located on the second surface, in electrical communication with the first and second arrays of substrate pads, and protruding from the second surface a second profile distance, with the second profile distance exceeding the first profile distance.
 2. The method of claim 1 wherein providing the semiconductor die comprises providing a semiconductor die with the die pads including: a first row of die pads in electrical communication with the first array of substrate pads; and a second row of die pads in electrical communication with the second array of substrate pads.
 3. The method of claim 2, wherein providing the substrate comprises providing a substrate with the first and second sides of the opening being parallel to each other.
 4. The method of claim 3, wherein providing the substrate comprises providing a substrate lacking substrate pads adjacent to ends of the opening.
 5. The method of claim 1, wherein providing the adhesive comprises providing an adhesive that extends beyond an outer periphery of the semiconductor die.
 6. The method of claim 5, wherein providing the adhesive comprises providing an adhesive that does not extend beyond a periphery of the opening of the substrate.
 7. The method of claim 1, wherein providing the adhesive comprises providing an adhesive that does not extend beyond a periphery of the opening of the substrate.
 8. The method of claim 1, wherein providing solder balls comprises providing at least some solder balls at locations on the second surface of the substrate with which the semiconductor die adjacent to the first surface of the substrate is not superimposed.
 9. The method of claim 8, wherein providing solder balls comprises providing at least some solder balls at locations on the second surface of the substrate with which the semiconductor die adjacent to the first surface of the substrate is superimposed.
 10. The method of claim 9, wherein providing solder balls comprises providing a majority of the solder balls at locations on the second surface of the substrate with which the semiconductor die adjacent to the first surface of the substrate is superimposed.
 11. The method of claim 1, wherein providing solder balls comprises providing at least some solder balls at locations on the second surface of the substrate with which the semiconductor die adjacent to the first surface of the substrate is superimposed.
 12. The method of claim 1, further comprising: providing a master printed circuit board including connector pads to which the solder balls are soldered, the master printed circuit board including conductive traces for establishing electrical communication between the connector pads and electrical components mounted to the master printed circuit board.
 13. The method of claim 12, wherein: providing the semiconductor die comprises providing a semiconductor die with die pads arranged in a non-industry-standard pattern; and providing the master printed circuit board comprises providing a master printed circuit board with connector pads arranged in an industry-standard pattern.
 14. The method of claim 1, wherein: providing the semiconductor die comprises providing a semiconductor die with die pads arranged in a non-industry-standard pattern; and providing the solder balls comprises providing the solder balls on the second surface of the substrate in an industry-standard pattern.
 15. The method of claim 1, wherein providing the substrate comprises providing a substrate with a substantially planar first surface and at least one lateral dimension that exceeds a corresponding lateral dimension of the semiconductor die.
 16. The method of claim 15, wherein providing the semiconductor die comprises providing a semiconductor die in an arrangement with the substrate the at least one lateral dimension of the substrate and the corresponding lateral dimension of the semiconductor die are substantially aligned and a portion of the substrate extends laterally beyond an outer periphery of the semiconductor die.
 17. The method of claim 1, wherein providing the substrate comprises providing a substrate with an opening having a length at least as long as a corresponding dimension of the semiconductor die.
 18. The method of claim 17, wherein providing the semiconductor die comprises providing the semiconductor die in an arrangement with the substrate in which the opening of the substrate extends substantially from one outer peripheral edge of the semiconductor die to an opposite outer peripheral edge of the semiconductor die.
 19. The method of claim 1, wherein providing the solder balls comprises: providing a first three rows of solder balls arranged parallel to the center axis of the substrate, in a first region of the second surface of the substrate, the first region being located between the encapsulant and a first edge of the substrate; and providing a second three rows of solder balls arranged parallel to the center axis of the substrate, in a second region of the second surface of the substrate, the second region being located between the encapsulant and a second edge of the substrate, the second edge being opposite from the first edge.
 20. The method of claim 19, wherein providing solder balls comprises providing no more than three rows of solder balls in the first region of the second surface of the substrate and no more than three rows of solder balls in the second region of the second surface of the substrate.
 21. The method of claim 19, wherein providing solder balls comprises providing at least some solder balls at locations on the second surface of the substrate with which the semiconductor die adjacent to the first surface of the substrate is not superimposed.
 22. The method of claim 1, wherein providing the encapsulant comprises providing an encapsulant substantially laterally confined within a boundary over the second surface of the substrate surrounding the opening and located between the substrate pads and the solder balls.
 23. The method of claim 1, wherein providing the encapsulant comprises providing an encapsulant that is substantially absent from regions of the second surface in a vicinity of the solder balls.
 24. The method of claim 1, wherein providing the substrate comprises providing a substantially planar substrate of sufficient rigidity to maintain planarity in an outer peripheral region located laterally beyond an outer periphery of the semiconductor die.
 25. The method of claim 24, wherein providing the substrate comprises providing a substrate with the peripheral region being at least as wide as a pitch between the solder balls.
 26. The method of claim 1, further comprising: providing an encapsulating material on the first surface of the substrate and surrounding an outer periphery of the semiconductor die.
 27. A method for providing a semiconductor device, comprising: providing a semiconductor die comprising die pads along a center region of an active surface; providing a substrate comprising a single slot aligned with the die pads, a substantially planar first surface, a substantially planar second surface parallel to the first surface, and first and second arrays of substrate pads on the substantially planar second surface, proximate first and second sides of the single slot, respectively, wherein the first and second arrays of substrate pads have at least three rows of substrate pads parallel to the slot; providing adhesive between the active surface of the die and the first surface of the substrate; providing bond wires that pass through the single slot, with first ends of the bond wires bonded to the die pads and second ends of the bond wires bonded to the first and second arrays of substrate pads; providing encapsulant filling the single slot and protruding a first distance beyond a plane in which the second surface of the substrate is located; and providing solder balls protruding a second distance from the second surface of the substrate, the second distance being greater than the first distance, the solder balls being configured to establish electrical communication between the semiconductor die and at least one other electronic component.
 28. The method of claim 27, wherein providing the semiconductor die comprises providing a semiconductor die with die pads arranged in: a first row in electrical communication with the first array of substrate pads; and a second row in electrical communication with the second array of substrate pads.
 29. The method of claim 27, wherein providing the substrate comprise providing a substrate with all of the substrate pads being located proximate to a first side of the single slot or a second side of the single slot.
 30. The method of claim 27, wherein providing the adhesive comprises providing an adhesive that extends laterally beyond an outer periphery of the semiconductor die.
 31. The method of claim 30, further comprising: providing another encapsulant on the first surface of the substrate and surrounding an outer periphery of the semiconductor die.
 32. The method of claim 30, wherein providing the adhesive comprises providing an adhesive substantially laterally confined outside of an interior periphery of the substrate defining the single slot.
 33. The method of claim 27, wherein providing the adhesive comprises providing an adhesive substantially laterally confined outside of an interior periphery of the substrate defining the single slot.
 34. The method of claim 27, wherein providing the solder balls comprises providing at least some solder balls at locations on the second surface of the substrate with which the semiconductor die adjacent to the first surface of the substrate is not superimposed.
 35. The method of claim 34, wherein providing solder balls comprises providing a majority of the solder balls at locations on the second surface of the substrate with which the semiconductor die adjacent to the first surface of the substrate is superimposed.
 36. The method of claim 27, wherein providing solder balls comprises providing a majority of the solder balls at locations on the second surface of the substrate with which the semiconductor die adjacent to the first surface of the substrate is superimposed.
 37. The method of claim 27, further comprising: providing a printed circuit board including connector pads to which the solder balls are soldered, the printed circuit board including conductive traces for establishing electrical communication between the connector pads and electrical components mounted to the printed circuit board.
 38. The method of claim 37, wherein: providing the semiconductor die comprises providing a semiconductor die with die pads arranged in a non-industry-standard pattern; and providing the printed circuit board comprises providing a printed circuit board with connector pads arranged in an industry-standard pattern.
 39. The method of claim 27, wherein: providing the semiconductor die comprises providing a semiconductor die with die pads arranged in a non-industry-standard pattern; and providing the solder balls comprises providing solder balls in an industry-standard pattern.
 40. The method of claim 27, wherein providing the substrate comprises providing a substrate of sufficient rigidity to maintain planarity in an outer peripheral region located laterally beyond an outer periphery of the semiconductor die.
 41. The method of claim 40, wherein providing the substrate comprises providing a substrate with the peripheral region being at least as wide as a pitch between the solder balls.
 42. The method of claim 27, wherein providing the substrate comprises providing a substrate with the single slot having a length at least as long as a corresponding dimension of the semiconductor die.
 43. The method of claim 42, wherein providing the semiconductor die comprises providing the semiconductor die in an arrangement with the substrate in which the single slot of the substrate extends substantially from one outer peripheral edge of the semiconductor die to an opposite outer peripheral edge of the semiconductor die.
 44. The method of claim 43, wherein providing the substrate comprises providing a substrate of sufficient rigidity to maintain planarity in outer peripheral region located laterally beyond an outer periphery of the semiconductor die.
 45. The method of claim 27, wherein providing the solder balls comprises: providing a first three rows of solder balls arranged parallel to the single slot of the substrate, in a first region of the second surface of the substrate, the first region being located between the encapsulant and a first edge of the substrate; and providing a second three rows of solder balls arranged parallel to the single slot of the substrate, in a second region of the second surface of the substrate, the second region being located between the encapsulant and a second edge of the substrate, the second edge being opposite from the first edge.
 46. The method of claim 45, wherein providing solder balls comprises providing no more than three rows of solder balls in the first region of the second surface of the substrate and no more than three rows of solder balls in the second region of the second surface of the substrate.
 47. The method of claim 45, wherein providing solder balls comprises providing at least some solder balls at locations on the second surface of the substrate with which the semiconductor die adjacent to the first surface of the substrate is not superimposed.
 48. The method of claim 27, wherein providing the encapsulant comprises providing an encapsulant substantially laterally confined within a boundary over the second surface of the substrate surrounding the single slot and located between the substrate pads and the solder balls.
 49. The method of claim 27, wherein providing the encapsulant comprises providing an encapsulant that does not encroach into the first or second region of the second surface of the substrate.
 50. The method of claim 27, wherein providing the substrate comprises providing a printed circuit board.
 51. A method, comprising: providing a packaged device comprising a semiconductor die, having die pads near a center line of the die, adhered to a top side of a substantially planar package substrate having a through-hole through which conductive wires, bonded to the die pads, pass through and touch down on a bottom side of the substrate wherein the bottom side of the substrate has two arrays of substrate connectors a first array disposed on a first side of the through hole and having at least three rows of substrate pads and a second array disposed on a second side of the through hole and having at least three rows of substrate pads, wherein an encapsulating material is disposed in the through-hole and protrudes a first distance beyond a plane defined by the bottom side of the substrate; and providing a PCB, to which other electrical components are mounted, comprising conductive traces to provide electrical communication between the die and the other electrical components, wherein the bottom side of the substrate is attached to the PCB via solder elements, and the first distance that the encapsulating material protrudes is less than a second distance between the bottom side of the substrate and the PCB.
 52. The method of claim 51, wherein providing the packaged device comprises providing the device wherein the conductive wires are bond wires.
 53. The method of claim 52, wherein providing the packaged device comprises providing the device wherein the die pads comprise two or more rows of die pads.
 54. The method of claim 53, wherein providing the packaged device comprises providing the device wherein the die pads comprise first and second rows of die pads electrically coupled by the bond wires to first and second arrays of substrate pads, respectively, adjacent to first and second sides of the through-hole, respectively.
 55. The method of claim 54, wherein providing the packaged device comprises providing the device wherein the first and second sides of the through-hole are the only sides of the through-hole having substrate pads proximate thereto, the substrate comprises only one through-hole, and the through-hole exposes the die to the encapsulating material from approximately one edge of the die to another.
 56. The method of claim 51, wherein providing the PCB comprises providing the PCB wherein the first distance is at least a majority of the second distance between the bottom side of the substrate and the PCB.
 57. The method of claim 51, wherein providing the packaged device comprises providing the device further comprising an adhering material to adhere the die to the top side of the package substrate, wherein the adhering material does not encroach above the through-hole, and further comprising an encapsulating material disposed on the top side of the substrate and surrounding a periphery of the die.
 58. The method of claim 57, wherein providing the packaged device comprises providing the device wherein the adhering material extends beyond a periphery of the die.
 59. The method of claim 51, wherein providing the packaged device comprises providing the device wherein the encapsulating material tapers toward the plane from a portion of the encapsulating material disposed beneath the center line of the die.
 60. The method of claim 51, wherein providing the PCB comprises providing the PCB wherein at least some of the solder elements are at least partially disposed outside of any location underneath the die.
 61. The method of claim 60, wherein providing the PCB comprises providing the PCB wherein a majority of the solder elements are disposed underneath the die.
 62. The method of claim 51, wherein providing the PCB comprises providing the PCB wherein most of the solder elements are disposed underneath the die.
 63. The method of claim 51, wherein providing the PCB comprises providing the PCB wherein the solder elements are arranged in accordance with an industry-standard pattern and the die pads are arranged in a non-industry-standard pattern.
 64. The method of claim 63, wherein providing the packaged device comprises providing the device wherein the through-hole exposes a region of the die to the encapsulating material that extends from one edge of the die to an opposite edge of the die.
 65. The method of claim 51, wherein providing the packaged device comprises providing the device wherein the substrate is sufficiently rigid to maintain planarity in a region between outer edges of the die and outer edges of the substrate.
 66. The method of claim 65, wherein providing the PCB comprises providing the PCB wherein the solder elements have a minimum pitch and at least one side of the peripheral region is at least as wide as the pitch.
 67. The method of claim 51, wherein providing the packaged device comprises providing the device wherein the through-hole exposes a region of the die to the encapsulanting material that extends from one edge of the die to an opposite edge of the die.
 68. The method of claim 67, wherein providing the packaged device comprises providing the device wherein the substrate is of sufficient rigidity to maintain planarity in a peripheral region that extends out from a periphery of the die to a periphery of the substrate.
 69. The method of claim 51, wherein providing the PCB comprises providing the PCB wherein a first three rows of the solder elements, parallel to the through-hole, are disposed beneath a first region of the bottom side of the substrate that extends between the through-hole and a first edge of the substrate, and a second three rows of the solder balls, parallel to the through-hole, are disposed beneath a second region of the bottom side of the substrate that extends between the through-hole and a second edge, opposite the first edge, of the substrate.
 70. The method of claim 69, wherein providing the packaged device comprises providing the device wherein the encapsulating material is substantially absent from beneath the first and second regions of the bottom side of the substrate other than proximate the through-hole.
 71. The method of claim 70, wherein providing the PCB comprises providing the PCB further comprising connector pads to which the solder elements are soldered, the connector pads are electrically coupled to the conductive traces, the through-hole exposes a region of the die to the encapsulating material that extends from one edge of the die to an opposite edge of the die, the connector pads are arranged in accordance with an industry-standard pattern, and the die pads are arranged in a non-industry-standard pattern.
 72. The method of claim 51, wherein providing the packaged device comprises providing the device further comprising encapsulating material disposed on the top side of the substrate and surrounding a periphery of the die.
 73. The method of claim 51, wherein providing the packaged device comprises providing the device wherein the package substrate is a printed circuit board. 